Integration scheme for non-volatile memory on gate-all-around structure

ABSTRACT

A integrated device including a non-volatile memory (NVM) and a nanosheet field effect transistor (FET) and a method of fabricating the device include patterning fins for a channel region of the NVM and the FET. The method also includes depositing an organic planarization layer (OPL) and a block mask to protect the fins for the channel region of the FET, conformally depositing a set of layers that make up an NVM structure in conjunction with the channel region of the NVM while protecting the fins for the channel region of the FET with the OPL and the block mask, and removing the OPL and the block mask protecting the fins for the channel region of the FET. Source and drain regions of the NVM and the FET are formed, and a gate of the FET is formed while protecting the NVM by depositing another OPL and another block mask.

DOMESTIC PRIORITY

This application is a division of U.S. application Ser. No. 16/169,207filed Oct. 24, 2018, the disclosure of which is incorporation herein byreference in its entirety.

BACKGROUND

The present invention relates to electronic devices with embeddednon-volatile memory (NVM), and more specifically, to an integrationscheme for NVM on a gate-all-around structure.

Electronic devices with embedded NVM are desirable in mobile andautomotive applications, because of their high speed, low powerconsumption, and reliability. In a nanosheet field effect transistor(nanosheet FET), the channel region between the source and drain regionsis defined by horizontal silicon sheets, called nanosheets or ananosheet stack. A fin FET, which has a channel region defined by a fin,is an example of a tri-gate FET, because the gate contacts threesurfaces (top and two sides) of the fin-shaped channel. The nanosheetFET is a gate-all-around (GAA) FET, because the gate contacts all foursurfaces of each of the nanosheets in the stack that defines the channelregion.

SUMMARY

Embodiments of the present invention are directed to an integrateddevice including a non-volatile memory (NVM) and a nanosheet fieldeffect transistor (FET) and methods of fabricating the device. Themethod includes patterning fins for a channel region of the NVM and thenanosheet FET, and depositing an organic planarization layer (OPL) and ablock mask to protect the fins for the channel region of the nanosheetFET. The method also includes conformally depositing a set of layersthat make up an NVM structure in conjunction with the channel region ofthe NVM while protecting the fins for the channel region of thenanosheet FET with the OPL and the block mask, and removing the OPL andthe block mask protecting the fins for the channel region of thenanosheet FET. Source and drain regions of the NVM and the nanosheet FETare formed, and a gate of the nanosheet FET is formed while protectingthe NVM by depositing another OPL and another block mask.

BRIEF DESCRIPTION OF THE DRAWINGS

The examples described throughout the present document will be betterunderstood with reference to the following drawings and description. Thecomponents in the figures are not necessarily to scale. Moreover, in thefigures, like-referenced numerals designate corresponding partsthroughout the different views.

FIGS. 1-43 show aspects of the process flow of the integratedfabrication of non-volatile memory (NVM) and a nanosheet field effecttransistor (FET) according to two or more embodiments of the invention,in which:

FIG. 1 shows a cross-sectional view of an intermediate structure thatwill form the nanosheet FET;

FIG. 2 shows a cross-sectional view of an intermediate structure thatwill form the NVM according to a first exemplary embodiment of theinvention;

FIG. 3 shows a cross-sectional view of an intermediate structure thatwill form the NVM according to a second exemplary embodiment of theinvention;

FIG. 4 shows the structure shown in FIG. 1 after directional depositionof a spacer material;

FIG. 5 shows the structure shown in FIG. 2 after directional depositionof a spacer material;

FIG. 6 shows the structure shown in FIG. 3 after directional depositionof a spacer material;

FIG. 7 shows the structure that forms the nanosheet FET following thedeposition of organic planarization layer (OPL) and a block mask;

FIG. 8 shows that the structure that forms a first exemplary embodimentof the NVM is not affected by the processing of the structure shown inFIG. 7;

FIG. 9 shows that the structure that forms a second exemplary embodimentof the NVM is also not affected by the processing of the structure shownin FIG. 7;

FIG. 10 shows that the structure shown in FIG. 7 is unaffected by anisotropic etch process;

FIG. 11 shows a result of performing an isotropic etch process on thestructure shown in FIG. 8;

FIG. 12 shows a result of performing an isotropic etch process on thestructure shown in FIG. 9;

FIG. 13 is a cross-sectional view that illustrates that furtherprocessing to form the NVM does not affect the structure used to formthe nanosheet FET;

FIG. 14 is a cross-sectional view that shows the result of depositingconformal layers on the channel regions and a hardmask above thestructure shown in FIG. 11;

FIG. 15 is a cross-sectional view that shows the result of depositingconformal layers on the channel regions and a hardmask above thestructure shown in FIG. 12;

FIG. 16 shows the result of removing the block mask and OPL from thestructure shown in FIG. 13;

FIG. 17 shows the result of removing the conformal layers in thetrenches between the channel regions that include silicon and silicongermanium of the structure shown in FIG. 14;

FIG. 18 shows the result of removing the conformal layers in thetrenches between the channel regions of silicon germanium of thestructure shown in FIG. 15;

FIG. 19 shows an overhead view used to indicate two differentcross-sectional cuts;

FIG. 20 shows the structure shown in FIG. 16 following deposition of apolysilicon gate fill;

FIG. 21 shows the structure shown in FIG. 17 following deposition of apolysilicon gate fill;

FIG. 22 shows the structure shown in FIG. 18 following deposition of apolysilicon gate fill;

FIG. 23 shows a different cross-sectional view of the structure shown inFIG. 20 following gate patterning and a spacer deposition;

FIG. 24 shows a different cross-sectional view of the structure shown inFIG. 21 following gate patterning and a spacer deposition;

FIG. 25 shows a different cross-sectional view of the structure shown inFIG. 22 following gate patterning and a spacer deposition;

FIG. 26 shows the cross-sectional view shown in FIG. 23 following a finrecess and source and drain epitaxy;

FIG. 27 shows the cross-sectional view shown in FIG. 24 following a finrecess and source and drain epitaxy;

FIG. 28 shows the cross-sectional view shown in FIG. 25 following a finrecess and source and drain epitaxy;

FIG. 29 shows the structure in FIG. 26 following an oxide fill and capdielectric hardmask removal;

FIG. 30 shows the structure in FIG. 27 following an oxide fill and capdielectric hardmask removal;

FIG. 31 shows the structure in FIG. 28 following an oxide fill and capdielectric hardmask removal;

FIG. 32 shows recess of the oxide fill in the structure shown in FIG.29;

FIG. 33 shows the formation of OPL and a block mask on the structureshown in FIG. 30;

FIG. 34 shows the formation of OPL and a block mask on the structureshown in FIG. 31;

FIG. 35 shows a cross-sectional view of the structure used to form thenanosheet FET following the formation of the replacement gate;

FIG. 36 shows the structure of FIG. 33 following removal of the blockmask and replacement of the OPL with the gate metal;

FIG. 37 shows the structure of FIG. 34 following removal of the blockmask and replacement of the OPL with the gate metal;

FIG. 38 shows one cross-sectional view of the nanosheet FET followingthe formation of the source and drain contacts;

FIG. 39 shows one cross-sectional view of the NVM according to the firstexemplary embodiment that shows the contacts;

FIG. 40 shows one cross-sectional view of the NVM according to thesecond exemplary embodiment that shows the contacts;

FIG. 41 is another cross-sectional view of the nanosheet FET shown inFIG. 38;

FIG. 42 is another cross-sectional view of the NVM shown in FIG. 39; and

FIG. 43 is another cross-sectional view of the NVM shown in FIG. 40.

DETAILED DESCRIPTION

It is understood in advance that although this invention includes adetailed description of exemplary gate-all-around (GAA) nanosheet FETarchitectures having silicon (Si) channel nanosheets and SiGesacrificial nanosheets, embodiments of the invention are not limited tothe particular FET architectures or materials described in thisspecification. Rather, embodiments of the present invention are capableof being implemented in conjunction with any other type ofnanosheet/nanowire FET architecture or materials now known or laterdeveloped. In this detailed description and in the claims, the termsnanosheet and nanowire are treated as being synonymous.

For the sake of brevity, conventional techniques related tosemiconductor device and integrated circuit (IC) fabrication may or maynot be described in detail herein. Moreover, the various tasks andprocess steps described herein can be incorporated into a morecomprehensive procedure or process having additional steps orfunctionality not described in detail herein. In particular, varioussteps in the manufacture of semiconductor devices andsemiconductor-based ICs are well known and so, in the interest ofbrevity, many conventional steps will only be mentioned briefly hereinor will be omitted entirely without providing the well-known processdetails.

Turning now to a description of technologies that are more specificallyrelevant to the present invention, transistors are semiconductor devicescommonly found in a wide variety of ICs. A transistor is essentially aswitch. When a voltage is applied to a gate of the transistor that isgreater than a threshold voltage, the switch is turned on, and currentflows through the transistor. When the voltage at the gate is less thanthe threshold voltage, the switch is off, and current does not flowthrough the transistor.

Typical semiconductor devices are formed using active regions of awafer. The active regions are defined by isolation regions used toseparate and electrically isolate adjacent semiconductor devices. Forexample, in an IC having a plurality of metal oxide semiconductor fieldeffect transistors (MOSFETs), each MOSFET has a source and a drain thatare formed in an active region of a semiconductor layer by incorporatingn-type or p-type impurities in the layer of semiconductor material.Disposed between the source and the drain is a channel (or body) region.Disposed above the body region is a gate electrode. The gate electrodeand the body are spaced apart by a gate dielectric layer.

MOSFET-based ICs are fabricated using so-called complementary metaloxide semiconductor (CMOS) fabrication technologies. In general, CMOS isa technology that uses complementary and symmetrical pairs of p-type andn-type MOSFETs to implement logic functions. The channel region connectsthe source and the drain, and electrical current flows through thechannel region from the source to the drain. The electrical current flowis induced in the channel region by a voltage applied at the gateelectrode.

The wafer footprint of an FET is related to the electrical conductivityof the channel material. If the channel material has a relatively highconductivity, the FET can be made with a correspondingly smaller waferfootprint. A known method of increasing channel conductivity anddecreasing FET size is to form the channel as a nanostructure. Forexample, a so-called gate-all-around (GAA) nanosheet FET is a knownarchitecture for providing a relatively small FET footprint by formingthe channel region as a series of nanosheets. In a known GAAconfiguration, a nanosheet-based FET includes a source region, a drainregion and stacked nanosheet channels between the source and drainregions. A gate surrounds the stacked nanosheet channels and regulateselectron flow through the nanosheet channels between the source anddrain regions. GAA nanosheet FETs are fabricated by forming alternatinglayers of channel nanosheets and sacrificial nanosheets. The sacrificialnanosheets are released from the channel nanosheets before the FETdevice is finalized. For n-type FETs, the channel nanosheets aretypically silicon (Si) and the sacrificial nanosheets are typicallysilicon germanium (SiGe). For p-type FETs, the channel nanosheets can beSiGe and the sacrificial nanosheets can be Si. In some implementations,the channel nanosheet of a p-type FET can be SiGe or Si, and thesacrificial nanosheets can be Si or SiGe. Forming the GAA nanosheetsfrom alternating layers of channel nanosheets formed from a first typeof semiconductor material (e.g., Si for n-type FETs, and SiGe for p-typeFETs) and sacrificial nanosheets formed from a second type ofsemiconductor material (e.g., SiGe for n-type FETs, and Si for p-typeFETs) provides superior channel electrostatics control, which isnecessary for continuously scaling CMOS technology down to seven (7)nanometer node and below. The use of multiple layered SiGe/Sisacrificial/channel nanosheets (or Si/SiGe sacrificial/channelnanosheets) to form the channel regions in GAA FET semiconductor devicesprovides desirable device characteristics, including the introduction ofstrain at the interface between SiGe and Si.

Although nanosheet channel FET architectures provide increased devicedensity over planar FET architectures, there are still challenges whenattempting to fabricate nanosheet channel FETs that provide theperformance characteristics required for a particular application. Someof these challenges apply, as well, to other types of FETs (e.g., finFETs, nanowire FETs). For example, as previously noted, it can bedesirable to embed NVM in electronic devices. Currently, NVMtechnologies are combined in a back end of line (BEOL) process. That is,after the nanosheet FET is formed, additional layers are added to formthe NVM. This can lead to performance degradation due to thermal budgetlimitation, high power consumption, and oxidization.

Turning now to an overview of aspects of the invention, embodiments ofthe invention address the above-noted shortcomings of the prior art byimplementing an integration scheme for NVM on a GAA structure. A frontend of line (FEOL) process is used to form the NVM such that thenanosheet FET and NVM are processed together. Specifically, processingof a depleted polysilicon-oxide-nitride-oxide-silicon (SONOS)-type NVMis integrated on the same wafer as a nanosheet FET device. TheSONOS-type flash memory exhibits improved data retention over othertechnologies like floating gate devices. Two different exemplaryembodiments of the invention are specifically discussed, one thatinvolves an NVM with a SiGe channel and one that involves an NVM with aSi channel.

FIGS. 1-43 illustrate aspects of the integration scheme for NVM on agate-all-around structure according to one or more embodiments of theinvention. FIG. 1 shows a cross-sectional view of an intermediatestructure 100 a in the formation of a nanosheet FET. FIG. 2 shows across-sectional view of an intermediate structure 100 b in the formationof an NVM according to an exemplary embodiment of the invention. FIG. 3shows a cross-sectional view of an intermediate structure 100 c in theformation of an NVM according to a different exemplary embodiment of theinvention. The intermediate structures 100 a and 100 b or 100 a and 100c are formed at the same time according to the integration schemeimplemented according to embodiments of the invention. The structures100 a and 100 b are the same. Fins of alternating SiGe 120 and Si 125are formed on a substrate 110, and a hardmask 130 (e.g., silicon nitride(SiN)) is formed on the fins. The number of SiGe 120 and Si 125 portionsand their relative thicknesses are not limited by the example shown inthe figures. The structure 100 c has fins of only SiGe 120 with thehardmask 130 deposited above.

The substrate 110 can include a bulk semiconductor, such as silicon,germanium, silicon germanium, silicon carbide, and those consistingessentially of III-V compound semiconductors having a compositiondefined by the formula Al_(X1)Ga_(X2)In_(X3)As_(Y1)P_(Y2)N_(Y3)Sb_(Y4),where X1, X2, X3, Y1, Y2, Y3, and Y4 represent relative proportions,each greater than or equal to zero and X1+X2+X3+Y1+Y2+Y3+Y4=1 (1 beingthe total relative mole quantity). Other suitable substrates 110 includeII-VI compound semiconductors having a compositionZn_(A1)Cd_(A2)Se_(B1)Te_(B2), where A1, A2, B1, and B2 are relativeproportions each greater than or equal to zero and A1+A2+B1+B2=1 (1being a total mole quantity). The semiconductor substrate 110 can alsocomprise an organic semiconductor or a layered semiconductor such as,for example, Si/SiGe, a silicon-on-insulator or a SiGe-on-insulator. Aportion or entire semiconductor substrate 110 can be amorphous,polycrystalline, or monocrystalline. In addition to the aforementionedtypes of semiconductor substrates 110, the substrate 410 can alsocomprise a hybrid oriented (HOT) semiconductor substrate in which theHOT substrate has surface regions of different crystallographicorientation. The substrate 110 can be doped, undoped, or contain dopedregions and undoped regions therein. The substrate 110 can containregions with strain and regions without strain therein, or containregions of tensile strain and compressive strain. In one or moreembodiments, the substrate 110 can be a semiconductor-on-insulator (SOI)substrate. The substrate 110 can further include other structures (notshown) such as shallow trench isolation (STI), fins, nanowires,nanosheets, resistors, capacitors, etc.

FIGS. 4-6 show cross-sectional views of structures 400 a, 400 b, 400 c,respectively, that result from directional deposition of a bottom spacer410 on the structures 100 a, 100 b, 100 c. The bottom spacer 410 can beSiN. FIG. 7 shows the structure 700 a that results from the depositionof a block mask 710 and an organic planarization layer (OPL) 720 overthe structure 400 a that will ultimately form the nanosheet FET. FIGS. 8and 9 respectively show the structures 700 b and 700 c which areunchanged from structures 400 b and 400 c in FIGS. 5 and 6. The blockmask 710 protects the structure 400 a, shown in FIG. 4, which is used toform the nanosheet FET while the NVM is formed based on furtherprocessing of the structure 700 b, according to one exemplary embodimentof the invention, or further processing of the structure 700 c,according to another exemplary embodiment of the invention.

FIG. 10 shows the structure 1000 a that results from an isotropic etchback process. As a comparison of FIGS. 7 and 10 indicates, the isotropicetch does not affect the structure 700 a, which is protected by theblock mask 710. FIGS. 11 and 12 respectively show structures 1000 b and1000 c that result from the same isotropic etch back process thatresults in the structure 1000 a. FIG. 11 shows the intermediatestructure 1000 b that results in the NVM according to one exemplaryembodiment and FIG. 12 shows the intermediate structure 1000 c thatresults in the NVM according to another exemplary embodiment. Instructure 1000 b, the fins of alternating Si 125 and SiGe 120 are etchedback, as shown. In structure 1000 c, the fins of SiGe 120 are etchedback, as shown.

FIG. 13 shows the structure 1300 a, which is unchanged from thestructure 1000 a in FIG. 12. FIGS. 14 and 15 respectively show thestructures 1300 b and 1300 c that result from a set of processes. Theprocesses include removal of the hardmask 130 and conformal depositionof tunnel layer 1410 (e.g., silicon oxide-nitride (SiON)), a trappinglayer 1420 (e.g., halfnium oxide (HfO₂) or other high-k material), and ablocking layer 1430 (e.g., silicon dioxide (SiO₂)). The tunnel layer1410, trapping layer 1420, and block layer 1430 can be referred totogether as the NVM stack 1405. The conformal depositions are followedby directional deposition of another hardmask 1440 (e.g., SiN). Aspreviously noted, the block mask 710 on the structure 1000 a ensuresthat none of these processes has an effect on the structure 1300 a.

FIG. 16 shows the structure 1600 a that results from removal of theblock mask 710 and OPL 720. The bottom spacer 410 is also removed. As aresult, only the substrate 110 and the fins of alternating SiGe 120 andSi 125 remain in the intermediate structure 1600 a that will ultimatelyform the nanosheet FET. FIGS. 17 and 18 respectively show the structures1600 b and 1600 c that result from removal of the NVM stack 1405 in thetrench between the fins of SiGe 120 and Si 125, in the case of structure1600 b, and between the fins of SiGe 120, in the case of structure 1600c. A directional plasma reactive ion etch (ME) process is used to removethe NVM stack 1405 in the trenches. The hardmask 1440 is also removedfrom the structures 1400 b and 1400 c shown, respectively, in FIGS. 14and 15.

FIG. 19 shows an overhead view of the structure 1400 b shown in FIG. 14.The overhead view is the same as for the structure 1400 c shown in FIG.15 and is also representative of the structure 1400 a shown in FIG. 13.Two cross-sections are indicated in FIG. 19. The cross-section A-A isacross the fins, as indicated. In the case of the structures 1400 a and1400 b, the fins are made up of alternating SiGe 120 and Si 125. In thecase of the structure 1400 c, the fins are made up of SiGe 120. Thecross-section B-B is along a fin, as indicated.

FIG. 20 shows a cross-sectional view across the fins (cross-section A-Aindicated in FIG. 19) of a structure 2000 a that results from thedeposition of a dummy polysilicon gate fill 2010 followed by a chemicalmechanical planarization (CMP) process. The dummy polysilicon gate fill2010 is deposited on the structure 1600 a shown in FIG. 16 to result inthe structure 2000 a. FIGS. 21 and 22 respectively show cross-sectionalviews of structures 2000 b and 2000 c. The structure 2000 b results fromthe deposition of the dummy polysilicon gate fill 2010 on the structure1600 b shown in FIG. 17, which will form the NVM according to anexemplary embodiment of the invention. The structure 2000 c results fromthe deposition of the dummy polysilicon gate fill 2010 on the structure1600 c shown in FIG. 18, which will form the NVM according to anotherexemplary embodiment of the invention.

FIGS. 23, 24, and 25 show cross-sectional views along a fin(cross-section B-B indicated in FIG. 19). FIG. 23 shows across-sectional view of a structure 2300 a that will form the nanosheetFET, while FIGS. 24 and 25 respectively show cross-sectional views ofstructures 2300 b and 2300 c that will form NVMs according to alternateembodiments of the invention. In each of the structures 2300 a, 2300 b,2300 c, the dummy polysilicon gate fill 2010 is patterned into fins anda hardmask spacer 2310 is formed, as shown. The spacer 2310 can be SiN,for example.

FIGS. 26, 27, and 28 show cross-sectional views along a fin(cross-section B-B indicated in FIG. 19). The figures show structures2600 a, 2600 b, 2600 c that result from a fin recess followed by sourceand drain epitaxy. Specifically, source or drain material 2610 isdeposited, and that source or drain material 2610 can be Si:boron (B) orSiGe:B in a p-type FET or Si:phosphorous (P) or SiGe:P in an n-type FET,for example. FIGS. 29, 30, and 31 show cross-sectional views ofstructures 2900 a, 2900 b, and 2900 c, respectively. The structures 2900a, 2900 b, 2900 c result from a fill with oxide 2910 between the dummypolysilicon gate fill 2010 and, more specifically, between the spacers2310. The oxide 2910 can be flowable oxide (FOX) and SiO2. A CMP processis performed after the deposition of the oxide 2910. This CMP processlands on and removes the material of the spacer 2310 that is on top ofthe dummy polysilicon gate fill 2010 (i.e., the cap dielectrichardmask).

FIG. 32 shows a cross-sectional view of a structure 3200 a that formsthe nanosheet FET. The oxide 2910 is recessed, as shown. FIGS. 33 and 34show cross-sectional views, respectively, of structures 3200 b, 3200 cthat form the NVM according to alternate embodiments. Both structures3200 b and 3200 c include a block mask 3320 and an OPL 3310. The blockmask 3320 and OPL 3310 protect the underlying structures during furtherprocessing of the structure 3200 a to replace the dummy polysilicon gatefill 2010 with the gate, as discussed with reference to FIG. 35.

FIG. 35 shows a cross-sectional view of a structure 3500 a that isformed into the nanosheet FET. The cross-sectional view shown in FIG. 35is along a fin (cross-section B-B as indicated in FIG. 19). A polygatepull is performed to remove the dummy polysilicon gate fill 2010. TheSiGe 120, shown in FIG. 32, for example, is fully released. This isfollowed by depositions of a high-k dielectric 3510, and a workfunctionmetal 3520. A gate fill 3530 is then performed followed by a CMPprocess. The gate fill 3530 can be tungsten (W), for example. FIGS. 36and 37 respectively show structures 3500 b and 3500 c, which are used toform NVM devices according to alternate embodiments of the invention.Like the structure 3500 a, the structures 3500 b and 3500 c are shown ascross-sectional views along a fin (cross-section B-B as indicated inFIG. 19). The block mask 3320 and the OPL 3310 are removed following thedeposition of the high-k dielectric 3510 and workfunction metal 3520 butprior to deposition of the gate fill 3530. Thus, the gate fill 3530 andsubsequent CMP process are reflected in the structures 3500 b and 3500c, as shown.

FIG. 38 shows a cross-sectional view of a structure 3800 a that is thenanosheet FET. The cross-sectional view shown in FIG. 38 is along a fin(cross-section B-B as indicated in FIG. 19). Contacts 3810 are patternedand filled to the source or drain material 2610 below. The metal fill ofthe contacts 3810 can be W. FIGS. 39 and 40 respectively show structures3800 b and 3800 c, which are essentially NVM devices according toalternate embodiments of the invention. The structures 3800 b and 3800 cinclude contacts 3910, as shown.

FIG. 41 shows a different cross-sectional view of the structure 3800 aof the nanosheet FET than the view shown in FIG. 38. The cross-sectionalview shown in FIG. 41 is across the fins (cross-section A-A as indicatedin FIG. 19). FIGS. 42 and 43 show different cross-sectional views of therespective structures 3800 b and 3800 c than those shown in FIGS. 39 and40. The cross-sectional views in FIGS. 42 and 43 are across the fins.FIG. 42 shows a different cross-sectional view of the NVM structure 3800b shown in FIG. 39, and FIG. 43 shows a different cross-sectional viewof the NVM structure 3800 c shown in FIG. 40.

FIGS. 42 and 43 show that the NVM according to each of the exemplaryembodiments is a SONOS-type flash memory. Specifically, the SONOS layersinclude polysilicon gate fill 2010 (S), blocking layer 1430 such as SiO₂(O), tunnel layer 1410 such as SiON (NO), and the channel SiGe 120 or Si125 (S). Specifically, the conformal layers (i.e., the NVM stack 1405)around the channel are the “ONO” in the SONOS structure of the NVM.Based on the high-k trapping layer 1420, the NVM according to theembodiments is a further variant of the SONOS-type flash memory referredto as SHINOS (silicon, high-k, nitride, oxide, silicon). That is,polysilicon gate fill 2010 (S), trapping layer 1420 such as HfO₂ (HI),tunnel layer 1410 such as SiON (NO), and the channel SiGe 120 or Si 125(S).

The methods and resulting structures described herein can be used in thefabrication of IC chips. The resulting IC chips can be distributed bythe fabricator in raw wafer form (that is, as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case, the chip is mounted in a single chip package (such as aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (such as a ceramiccarrier that has either or both surface interconnections or buriedinterconnections). In any case, the chip is then integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either (a) an intermediate product, such as a motherboard, or(b) an end product. The end product can be any product that includes ICchips, ranging from toys and other low-end applications to advancedcomputer products having a display, a keyboard or other input device,and a central processor.

Various embodiments of the present invention are described herein withreference to the related drawings. Alternative embodiments can bedevised without departing from the scope of this invention. Althoughvarious connections and positional relationships (e.g., over, below,adjacent, etc.) are set forth between elements in the detaileddescription and in the drawings, persons skilled in the art willrecognize that many of the positional relationships described herein areorientation-independent when the described functionality is maintainedeven though the orientation is changed. These connections and/orpositional relationships, unless specified otherwise, can be direct orindirect, and the present invention is not intended to be limiting inthis respect. Similarly, the term “coupled” and variations thereofdescribes having a communications path between two elements and does notimply a direct connection between the elements with no interveningelements/connections between them. All of these variations areconsidered a part of the specification. Accordingly, a coupling ofentities can refer to either a direct or an indirect coupling, and apositional relationship between entities can be a direct or indirectpositional relationship. As an example of an indirect positionalrelationship, references in the present description to forming layer “A”over layer “B” include situations in which one or more intermediatelayers (e.g., layer “C”) is between layer “A” and layer “B” as long asthe relevant characteristics and functionalities of layer “A” and layer“B” are not substantially changed by the intermediate layer(s).

The following definitions and abbreviations are to be used for theinterpretation of the claims and the specification. As used herein, theterms “comprises,” “comprising,” “includes,” “including,” “has,”“having,” “contains” or “containing,” or any other variation thereof,are intended to cover a non-exclusive inclusion. For example, acomposition, a mixture, process, method, article, or apparatus thatcomprises a list of elements is not necessarily limited to only thoseelements but can include other elements not expressly listed or inherentto such composition, mixture, process, method, article, or apparatus.

Additionally, the term “exemplary” is used herein to mean “serving as anexample, instance or illustration.” Any embodiment or design describedherein as “exemplary” is not necessarily to be construed as preferred oradvantageous over other embodiments or designs. The terms “at least one”and “one or more” are understood to include any integer number greaterthan or equal to one, i.e. one, two, three, four, etc. The terms “aplurality” are understood to include any integer number greater than orequal to two, i.e. two, three, four, five, etc. The term “connection”can include an indirect “connection” and a direct “connection.”

References in the specification to “one embodiment,” “an embodiment,”“an example embodiment,” etc., indicate that the embodiment describedcan include a particular feature, structure, or characteristic, butevery embodiment may or may not include the particular feature,structure, or characteristic. Moreover, such phrases are not necessarilyreferring to the same embodiment. Further, when a particular feature,structure, or characteristic is described in connection with anembodiment, it is submitted that it is within the knowledge of oneskilled in the art to affect such feature, structure, or characteristicin connection with other embodiments whether or not explicitlydescribed.

For purposes of the description hereinafter, the terms “upper,” “lower,”“right,” “left,” “vertical,” “horizontal,” “top,” “bottom,” andderivatives thereof shall relate to the described structures andmethods, as oriented in the drawing figures. The terms “overlying,”“atop,” “on top,” “positioned on” or “positioned atop” mean that a firstelement, such as a first structure, is present on a second element, suchas a second structure, wherein intervening elements such as an interfacestructure can be present between the first element and the secondelement. The term “direct contact” means that a first element, such as afirst structure, and a second element, such as a second structure, areconnected without any intermediary conducting, insulating orsemiconductor layers at the interface of the two elements.

Spatially relative terms, e.g., “beneath,” “below,” “lower,” “above,”“upper,” and the like, can be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the term “below” can encompass both an orientation ofabove and below. The device can be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein interpreted accordingly.

The terms “about,” “substantially,” “approximately,” and variationsthereof, are intended to include the degree of error associated withmeasurement of the particular quantity based upon the equipmentavailable at the time of filing the application. For example, “about”can include a range of ±8% or 5%, or 2% of a given value.

The phrase “selective to,” such as, for example, “a first elementselective to a second element,” means that the first element can beetched and the second element can act as an etch stop.

The term “conformal” (e.g., a conformal layer) means that the thicknessof the layer is substantially the same on all surfaces, or that thethickness variation is less than 15% of the nominal thickness of thelayer.

As previously noted herein, for the sake of brevity, conventionaltechniques related to semiconductor device and IC fabrication may or maynot be described in detail herein. By way of background, however, a moregeneral description of the semiconductor device fabrication processesthat can be utilized in implementing one or more embodiments of thepresent invention will now be provided. Although specific fabricationoperations used in implementing one or more embodiments of the presentinvention can be individually known, the described combination ofoperations and/or resulting structures of the present invention areunique. Thus, the unique combination of the operations described inconnection with the fabrication of a semiconductor device according tothe present invention utilize a variety of individually known physicaland chemical processes performed on a semiconductor (e.g., silicon)substrate, some of which are described in the immediately followingparagraphs.

In general, the various processes used to form a micro-chip that will bepackaged into an IC fall into four general categories, namely, filmdeposition, removal/etching, semiconductor doping andpatterning/lithography. Deposition is any process that grows, coats, orotherwise transfers a material onto the wafer. Available technologiesinclude physical vapor deposition (PVD), chemical vapor deposition(CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE)and more recently, atomic layer deposition (ALD) among others.Removal/etching is any process that removes material from the wafer.Examples include etch processes (either wet or dry), chemical-mechanicalplanarization (CMP), and the like. Reactive ion etching (ME), forexample, is a type of dry etching that uses chemically reactive plasmato remove a material, such as a masked pattern of semiconductormaterial, by exposing the material to a bombardment of ions thatdislodge portions of the material from the exposed surface. The plasmais typically generated under low pressure (vacuum) by an electromagneticfield. Semiconductor doping is the modification of electrical propertiesby doping, for example, transistor sources and drains, generally bydiffusion and/or by ion implantation. These doping processes arefollowed by furnace annealing or by rapid thermal annealing (RTA).Annealing serves to activate the implanted dopants. Films of bothconductors (e.g., poly-silicon, aluminum, copper, etc.) and insulators(e.g., various forms of silicon dioxide, silicon nitride, etc.) are usedto connect and isolate transistors and their components. Selectivedoping of various regions of the semiconductor substrate allows theconductivity of the substrate to be changed with the application ofvoltage. By creating structures of these various components, millions oftransistors can be built and wired together to form the complexcircuitry of a modern microelectronic device. Semiconductor lithographyis the formation of three-dimensional relief images or patterns on thesemiconductor substrate for subsequent transfer of the pattern to thesubstrate. In semiconductor lithography, the patterns are formed by alight sensitive polymer called a photo-resist. To build the complexstructures that make up a transistor and the many wires that connect themillions of transistors of a circuit, lithography and etch patterntransfer steps are repeated multiple times. Each pattern being printedon the wafer is aligned to the previously formed patterns and slowly theconductors, insulators and selectively doped regions are built up toform the final device.

The flowchart and block diagrams in the Figures illustrate possibleimplementations of fabrication and/or operation methods according tovarious embodiments of the present invention. Variousfunctions/operations of the method are represented in the flow diagramby blocks. In some alternative implementations, the functions noted inthe blocks can occur out of the order noted in the Figures. For example,two blocks shown in succession can, in fact, be executed substantiallyconcurrently, or the blocks can sometimes be executed in the reverseorder, depending upon the functionality involved.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments described. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdescribed herein.

What is claimed is:
 1. An integrated device including a non-volatilememory (NVM) and a nanosheet field effect transistor (FET), the devicecomprising: fins of a channel region of the NVM formed on a substrate;fins of a channel region of the nanosheet FET formed on the substrate; aset of layers that make up an NVM structure conformally covering onlythe fins of the channel region of the NVM; source and drain regionsbetween the fins of the channel region of the NVM and the fins of thechannel region of the nanosheet FET; and a gate formed above only thefins of the channel region of the nanosheet FET.
 2. The device accordingto claim 1, wherein the fins of the channel region of the NVM includealternating silicon and silicon germanium.
 3. The device according toclaim 1, wherein the fins of the channel region of the NVM includesilicon germanium.
 4. The device according to claim 1, wherein the setof layers that make up the NVM structure include silicon oxide nitridedirectly on the fins for the channel region of the NVM.
 5. The deviceaccording to claim 4, wherein the set of layers that make up the NVMstructure include hafnium dioxide on the silicon oxide nitride.
 6. Thedevice according to claim 5, wherein the set of layers that make up theNVM structure include silicon dioxide on the hafnium dioxide.
 7. Thedevice according to claim 1, further comprising gates formed above thefins of the channel region of the nanosheet FET.
 8. The device accordingto claim 1, further comprising contacts formed above the source anddrain regions of the NVM and the nanosheet FET.
 9. The device accordingto claim 1, further comprising polysilicon formed above the fins of thechannel region of the NVM, wherein the polysilicon is part of the NVMstructure.
 10. The device according to claim 9, further comprisingcontacts formed above the polysilicon.